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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

Brand Name : TOPCBS

Model Number : BIB and test Boards

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20units per package box size 20*15*10cm

Layer count : 12Layer

Raw material : High Tg FR4

Finished Treatment : Immerion Gold + OSP

Pitch Size : 0.25mm

Board thickness : 0.7mm

Line width/space : 75um/100um

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0.25 pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

  • Reduced product development time
  • Increased customer confidence
  • 100% product quality and reliability
  • A forecast life expectancy
  • Reduced circuit board manufacturing costs
  • Increased profitability
  • Reduced after sales service

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Name 0.25pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers 12
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material IT180
Thickness 0.7mm
Min Track/Spacing 75um/75um
Min Hole Size Laser 75um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold + OSP
Finished Copper 12um
Production time 10-21 working days
Lead time 2-3 days

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12LayerHigh Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer


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